AVS 65th International Symposium & Exhibition | |
Novel Trends in Synchrotron and FEL-Based Analysis Focus Topic | Wednesday Sessions |
Session SA+AS+MI-WeA |
Session: | Hard X-Ray Photoemission for Probing Buried Interfaces |
Presenter: | Shigenori Ueda, NIMS, Japan |
Correspondent: | Click to Email |
GaN is known as a polar semiconductor due to an alternative stacking of Ga and N layers along the c-axis. Ohsawa et al. [1] showed the difference in valence band spectral shapes of the bulk Ga- and N-polar GaN single crystals by using polarization dependent hard X-ray photoemission spectroscopy (HAXPES). In general, HAXPES is a bulk-sensitive probe [2], and take-off angle (TOA) dependent of photoelectron gives depth information [3]. However, the decrease of the photoemission intensity occurs in lower TOA, and the valence band spectra depend on TOA [3] due to the matrix element effect [4].
In this work, HAXPES combined with X-ray total reflection was used to obtain a depth-resolved electronic structure instead of TOA dependent measurements. The change of incidence angle within 1 degree around the critical angle of X-ray total reflection drastically changes the attenuation length of X-ray in solids.
We have measured the core-level and valence band HAXPES spectra of commercially available bulk single crystalline GaN for Ga and N polar faces in the case of inelastic mean free path of 2.17, 3.73, and 7.69 nm. Undoped n-type GaN crystal with fine polished surfaces was used. For the Ga-polar face, large band bending behavior was observed, while the band bending was small for the N-polar face. The Ga 3s and N 1s core-level spectra also showed the polarity dependent band bending behavior. We found that GaN near the surface is degraded in both the polar faces. This result suggests that high quality single crystalline GaN with fine surface treatment is required for detecting the intrinsic electronic structure of GaN. Finally we note that HAXPES combined with X-ray total reflection is useful method for depth-resolved electronic structure measurements, since the data acquisition time in this method is 10 or more faster than that in TOA dependent measurement, and the matrix element effect is almost negligible in this method.
References
[1] T. Ohsawa et al., Appl. Phys. Lett. 107(2015) 171604.
[2] Y. Takata et al., Nucl. Instrum. Methods Phys. Res., Sect. A 547(2005) 50.
[3] M. Lozac'h et al., Sci. Technol. Adv. Mater. 14(2013) 015007.
[4] S. M. Goldberg, C. S. Fadley, and S. Kono, J. Electron Spectrosc. Rel. Phenom. 21(1981) 285.