AVS 65th International Symposium & Exhibition
    Manufacturing Science and Technology Group Tuesday Sessions
       Session MS+MN-TuA

Invited Paper MS+MN-TuA1
Manufacturing Strategies for Flexible Hybrid Electronics

Tuesday, October 23, 2018, 2:20 pm, Room 202B

Session: IoT Session: Challenges of Sensor Manufacturing for the IoT
Presenter: Scott Miller, NextFlex
Correspondent: Click to Email
Flexible Hybrid Electronics (FHE) combines technologies and manufacturing capabilities from the worlds of printing and additive manufacturing; flexible, bendable, stretchable, and 3D substrates; and conventional silicon integrated circuits to bring novel form and function to high-performing electronic devices. The US manufacturing ecosystem for FHE is rapidly growing and applications of FHE devices are being advanced in areas as diverse, and yet overlapping, as human health and performance monitoring, antennas and wireless communications, soft robotics, structural health management, and IoT. A single device build can require solving substrate challenges, printing functional conductors, resistors, and dielectrics, placing discrete passives, attaching bare-die integrated circuits using conductive adhesives, integrating a power supply, and encapsulating the entire device. As a Manufacturing Institute, NextFlex works with its members on technologies that have passed the applied research stage to advance their readiness for manufacturing and position them for product development. This talk will explore challenges and opportunities in FHE, including translating designs to manufacturing, material and device characterization, availability of material and process data, and scaling processes to high-rate manufacturing. Approaches to address these challenges will be discussed and example projects related to IoT will be presented.