AVS 65th International Symposium & Exhibition
    Electronic Materials and Photonics Division Thursday Sessions
       Session EM+2D+NS+PS+RM+TF-ThA

Paper EM+2D+NS+PS+RM+TF-ThA3
Flexible Electronic Devices Based on Two Dimensional Materials

Thursday, October 25, 2018, 3:00 pm, Room 101A

Session: IoT Session: Flexible Electronics & Flash Networking Session
Presenter: Christopher Muratore, University of Dayton
Authors: R. Kim, Air Force Research Laboratory
N.R. Glavin, Air Force Research Laboratory
R.H. Rai, University of Dayton; Air Force Research Laboratory
K. Gliebe, University of Dayton; Air Force Research Laboratory
M. Beebe, University of Dayton; Air Force Research Laboratory
J. Leem, University of Illinois at Urbana-Champaign
S. Nam, University of Illinois at Urbana-Champaign
R. Rao, Air Force Research Laboratory
C. Muratore, University of Dayton
K.M. Burzynski, University of Dayton and Air Force Research Laboratory, Materials and Manufacturing Directorate
Correspondent: Click to Email

Low temperature synthesis of high quality 2D materials directly on flexible substrates remains a fundamental limitation towards realization of robust, strainable electronics possessing the unique physical properties of atomically thin structures. Here, we describe room temperature sputtering of uniform, stoichiometric amorphous MoS2, WSe2, and other transition metal dichalcogenides and subsequent large area (>2 cm2) photonic crystallization to enable direct fabrication of two-dimensional material photodetectors on large area flexible PDMS substrates. Fundamentals of crystallization kinetics for different monolithic and heterostructured TMDs are examined to evaluate this new synthesis approach for affordable, wearable devices. The photodetectors demonstrate photocurrent magnitudes and response times comparable to those fabricated via CVD and exfoliated materials on rigid substrates and the performance is unaffected by strains exceeding 5%. Other devices and circuits fabricated from crystallized 2D TMDs deposited on large area flexible substrates are demonstrated.