AVS 64th International Symposium & Exhibition
    Thin Films Division Tuesday Sessions
       Session TF-TuM

Invited Paper TF-TuM5
High Speed ALD of Multifunctional ALD Ultrabarriers for Flexible OLED Encapsulation

Tuesday, October 31, 2017, 9:20 am, Room 20

Session: Advanced CVD and ALD Processing, ALD Manufacturing and Spatial-ALD
Presenter: Jacques Kools, Encapsulix, France
Correspondent: Click to Email
In recent years, Atomic Layer Deposition (ALD) has established itself as a viable technology for deposition of ultrabarriers on large area electronic devices such as photovoltaics, OLED’s and organic electronics. As a first generation material, Alumina ( Al2O3) has been established as the workhorse material to deliver excellent water vapor and oxygen barrier properties. However, many devices require protection from a multitude of invasive fluxes, such as UV light, salt water, electromagnetic radiation, ... etc. A nanoengineered synthetic barrier material allows to tune the different physical properties of the barrier.

In this paper we will describe our recent work on the development of hardware and process for industrial deposition of nanoengineered barriers, with properties that have been optimized to the specific device requirements. Leveraging the unique ability of ALD to control materials on the atomic scale, multilayered barriers are constructed atomic layer by layer from a set of up to ten precursor materials. In this way, it is possible enhance the flexibility ( by the use alucone layers), the UV resistance ( by the use of TiO2), the resistance to liquid water.. etc.

Process development and manufacturing experience in the OLED industry will be discussed.