AVS 64th International Symposium & Exhibition
    Plasma Science and Technology Division Tuesday Sessions
       Session PS+SS-TuA

Paper PS+SS-TuA9
Controlling Low Temperature Plasma Surface Interactions for Atomic Layer Etching of Electronic Materials And Atmospheric Pressure Plasma-Treatments of Model Polymers and Biomolecules

Tuesday, October 31, 2017, 5:00 pm, Room Ballroom B

Session: The Science of Plasmas and Surfaces: Commemorating the Career of Harold Winters (ALL INVITED SESSION)
Presenter: Gottlieb S. Oehrlein, University of Maryland, College Park
Correspondent: Click to Email

Harold Winters’s pioneering work on the scientific understanding of plasma-surface interactions, in particular as applied to low temperature plasma-based etching of materials, much of it done in collaboration with John Coburn, 1 has become textbook material. As a colleague at IBM Research I had the opportunity to learn from Harold by discussing with him ideas on rate limiting factors in etching reactions, in particular the role of surface reaction layers and the role of ion bombardment. These topics were of great interest to him as a possible explanation of ion-neutral synergy and also of the doping effect of silicon etching. In this talk I will discuss the relationship of Harold’s work to topics in my own research, in particular to recent work performed by members of my group. These include atomic layer etching of SiO2 and other materials2 and interaction of the effluent of atmospheric pressure plasma sources with polymers and biomolecules.3

1 H.F. Winters and J.W. Coburn, "Surface science aspects of etching reactions," Surf. Sci. Rep. 14, 161 (1992)

2 D. Metzler, R. Bruce, S. Engelmann, E. A. Joseph, and G. S. Oehrlein, “Fluorocarbon assisted atomic layer etching of SiO2 using cyclic Ar/ C4F8 plasma”, J. Vac. Sci. Technol. A 32, 020603 (2014).

3 E. A. J. Bartis, A. J. Knoll, P. Luan, J. Seog, and G. S. Oehrlein, “On the Interaction of Cold Atmospheric Pressure Plasma with Surfaces of Bio-molecules and Model Polymers”, Plasma Chemistry and Plasma Processing 36, 121 (2016); P. Luan, A. J. Knoll, H. Wang, V. S. S. K. Kondeti, P. J. Bruggeman, and G. S. Oehrlein, "Model polymer etching and surface modification by a time modulated RF plasma jet: role of atomic oxygen and water vapor," Journal of Physics D-Applied Physics 50, 03LT02 (2017).

* I gratefully acknowledge the contributions and collaboration of D. Metzler, Kang-Yi Lin, C. Li, S. Engelmann, R. Bruce, E. Joseph, E. A. J. Bartis, A. J. Knoll, P. Luan, J. Seog, V. S. S. K. Kondeti, P. J. Bruggeman and D. Graves to some of the topics in this talk. Additionally, funding from National Science Foundation (CBET-1134273, PHY-1004256, PHY-1415353), US Department of Energy (DE-SC0001939) and Semiconductor Research Corporation (No. 2017-NM-2726) is thankfully acknowledged.