AVS 64th International Symposium & Exhibition
    Exhibitor Technology Spotlight Workshops Tuesday Sessions
       Session EW-TuL

Paper EW-TuL2
Design and Application of a New Laboratory-Based Scanning XPS/HAXPES Instrument

Tuesday, October 31, 2017, 12:40 pm, Room West Hall

Session: Exhibitor Technology Spotlight
Presenter: John Newman, Physical Electronics
Authors: R. Inoue, ULVAC-PHI, Japan
H. Yamazui, ULVAC-PHI, Japan
K. Watanabe, ULVAC-PHI, Japan
S.R. Bryan, Physical Electronics
J. Newman, Physical Electronics
J.E. Mann, Physical Electronics
Correspondent: Click to Email
X-ray Photoelectron Spectroscopy (XPS) is a widely used surface analysis technique with many well established industrial and research applications. The surface sensitivity (top 5-10 nm) of XPS and its ability to provide short-range chemical bonding information make the technique extremely popular in materials characterization and failure analysis laboratories. While its surface sensitivity is an important attribute, in some cases, the depth of analysis of XPS is not sufficient to analyze buried interfaces without first sputter etching the sample surface. However, sputter etching can often lead to alterations of the true surface chemistry. For this reason, some scientists turn to another technique - Hard X-ray Photoelectron Spectroscopy (HAXPES), available in some synchrotron radiation facilities. HAXPES utilizes X-rays typically defined as having energies greater than 5 keV. Depending on the energy used, these hard x-rays can provide for depths of analysis 3 or more times those of soft x-rays used on conventional XPS systems. This presentation will describe a newly developed laboratory-based instrument, the PHI Quantes, equipped with monochromated scanning Al Kα (1486.6 eV) and Cr Kα (5414.9 eV) x-ray sources, thus enabling both traditional XPS and HAXPES experiments in the same instrument. Combining both soft and hard x-ray analyses, we can gain an even better understanding of composition with depth and information at buried interfaces.