Paper SE-TuP1
Room Temperature Bonding of Polymer and Silicon Wafer using Vacuum Ultraviolet Surface Activation

Tuesday, November 8, 2016, 6:30 pm, Room Hall D

Vacuum ultraviolet (VUV; λ < 200 nm) light and active oxygen species generated by VUV light chemically introduce polar functional groups to the surface of organic materials, which are related to adhesive property and wettability. In our previous research ^[1][2], we investigated the VUV decomposition and chemical conversion of the chemisorbed self-assembled monolayers (SAMs) and polymers surfaces. Using the VUV treatment under the atmospheric pressure, we have succeeded in bonding of Cyclo-olefin polymer (COP) films, which is a nonpolar hydrocarbon polymer, and in bonding between the polymer film and metals such as copper and aluminum at temperature lower than the glass transition temperature of each polymer. However, because of the surface roughness, thermal stress and the presence of intermediate oxide layer, the bonding mechanism is still unclear. In this research, we carried out the surface activated bonding of COP and silicon(111) single crystal wafer as a model surface with atomic-scale flatness. The atomically flat surface enables us to bond different materials at room temperature. Bonding condition without roughness and thermal effects is desirable to reveal the effectiveness of VUV treatment of the surface. A bond strength test was conducted to elucidate the effect of surface modification and bonding conditions such as VUV-irradiation distance, VUV-irradiation time, terminal functional groups of SAMs.

References:

[1] Y. Kim, Y. Taniguchi, K. Murase, Y. Taguchi, H. Sugimura, Appl. Surf. Sci. 255, 3648-3654 (2009).