AVS 63rd International Symposium & Exhibition | |
Nanometer-scale Science and Technology | Monday Sessions |
Session NS-MoM |
Session: | Nanopatterning and Nanofabrication + 3D |
Presenter: | Ezra Bussmann, Sandia National Laboratories |
Authors: | J. Koepke, Sandia National Laboratories D. Scrymgeour, Sandia National Laboratories R.J. Simonson, Sandia National Laboratories M. Marshall, Sandia National Laboratories J. Owen, Zyvex Labs D. Ward, Sandia National Laboratories R. Muller, Sandia National Laboratories M. Carroll, Sandia National Laboratories S. Misra, Sandia National Laboratories E. Bussmann, Sandia National Laboratories |
Correspondent: | Click to Email |
Moore’s law extrapolates to microelectronic devices with atomic size features around 2020 [1]. Anticipating engineering of nanoelectronics at this scale, techniques to tune dopant profiles in silicon have evolved to the ultimate limit of single-atom control. A single atom transistor [2], a device with just one P dopant atom placed in the channel with atomic selectivity, was recently fabricated via hydrogen resist scanning tunneling microscopy (STM) lithography. Despite the promise of atomically precise dopant placement, there are significant challenges to fabrication based on STM lithography such as scale-up, robustness, yield, and reproducibility.
This talk describes techniques to evaluate and optimize the yield and reproducibility of patterning and incorporation for single dopant placement. The hydrogen resist STM lithography method uses electrons from the STM tip to selectively desorb hydrogen atoms from the Si(100) – 2×1:H surface. Dosing the sample with PH3 and annealing selectively incorporates P dopants into the regions patterned with the STM tip. The key challenges for fabricating the dopant arrays are alignment of the STM tip to the dimer rows of the Si(100) surface, choice of lithographic window size and patterning conditions, and identification of the incorporated dopant after dosing and annealing the sample. Scaling the arrays to larger sizes requires reproducible STM tips that pattern consistently and very low alignment error. Using the precise alignment of the STM tip to the dimer rows of Si(100) surface, we have improved lithography yield for patterning windows for single dopant incorporation from 10% to 40%. We have developed image analysis capability to rapidly identify the dopant atoms in order to verify the results of the array fabrication and provide feedback to the lithography and dosing conditions for process optimization. Comparing results of dopant incorporation with modeling enables fine tuning of the PH3 dosing and incorporation conditions to improve the single dopant yield.
This work was performed, in part, at the Center for Integrated Nanotechnologies, an Office of Science User Facility operated for the U.S. Department of Energy (DOE) Office of Science. Sandia National Laboratories is a multi-program laboratory managed and operated by Sandia Corporation, a wholly owned subsidiary of Lockheed Martin Corporation, for the U.S. Department of Energy's National Nuclear Security Administration under contract DE-AC04-94AL85000. Data collected using a ZyVector™ STM Lithography Control System from Zyvex Labs.
[1] International Technology Roadmap for Semiconductors, http://www.itrs2.net/.
[2] Fueschle, et al., Nat. Nano. 7(4), 242 (2012).