AVS 63rd International Symposium & Exhibition
    Electronic Materials and Photonics Monday Sessions
       Session EM-MoM

Paper EM-MoM8
Symmetry-Breaking Nanostructures for Light Trapping in Thin Crystalline Silicon Solar Cells

Monday, November 7, 2016, 10:40 am, Room 102B

Session: Advances in Photonics
Presenter: Seok Jun Han, University of New Mexico
Authors: S.J. Han, University of New Mexico
S. Ghosh, University of New Mexico
O.K. Abudayyeh, University of New Mexico
B.R. Hoard, University of New Mexico
E.C. Culler, University of New Mexico
J.E. Bonilla, University of New Mexico
S.M. Han, University of New Mexico
S.E. Han, University of New Mexico
Correspondent: Click to Email

While various materials have been investigated for photovoltaics, solar cells based on crystalline silicon (c-Si) dominate the current photovoltaics market. To reduce the cost of c-Si cells, wafer manufacturing companies have produced competitively priced thin c-Si films, ranging from a few microns to tens of microns, using a kerfless process. In such thin-film c-Si cells, light absorption becomes poorer than in thick films and light trapping is crucial to increase the photovoltaic efficiency. Han et al. have demonstrated that, among various light-trapping schemes, symmetry breaking in photonic nanostructures can approach the Lambertian light-trapping limit very closely. However, fabricating symmetry-breaking nanostructures in a scalable, cost-effective, manufacturable manner remains elusive. Here, we introduce a new approach to systematically break the symmetry in photonic nanostructures on c-Si surface. Using our approach, we fabricate low-symmetry inverted nanopyramid structures. Our method makes use of low-cost, manufacturable wet etching steps on c-Si(100) wafers without relying on expensive off-cut wafers. Our experiment and computational modeling demonstrate that the symmetry breaking can increase the Shockley-Queisser efficiency from 27.0 to 27.9% for a 10-micron-thick c-Si film. Further, our computation reveals that this improvement would increase from 28.1 to 30.0% with over-etching for a 20-micron-thick c-Si film.