AVS 63rd International Symposium & Exhibition
    Electronic Materials and Photonics Wednesday Sessions
       Session EM+NS-WeM

Invited Paper EM+NS-WeM1
Nanostructures on Surfaces: From Cluster Deposition to Low Energy Ion Bombardment

Wednesday, November 9, 2016, 8:00 am, Room 102A

Session: Nanoparticles for Electronics and Photonics
Presenter: Luke Hanley, University of Illinois at Chicago
Authors: L. Hanley, University of Illinois at Chicago
K. Steeves Lloyd, University of Illinois at Chicago
M.W. Majeski, University of Illinois at Chicago
I.L. Bolotin, University of Illinois at Chicago
M. Schmeling, Loyola University Chicago
I.V. Veryovkin, University of Illinois at Chicago
Correspondent: Click to Email

Two strategies are described for the preparation of unique nanostructures on surfaces or within thin films: cluster beam deposition and low energy ion beam irradiation. In cluster beam deposition, copper sulfide nanoparticles were prepared by magnetron sputtering under a flow of argon and hydrogen sulfide, then codeposited with evaporated pentacene to form a composite thin film (M.W. Majeski, et al., ACS Appl. Mater. Interf., 2014, http://dx.doi.org/10.1021/am5028428). This all-gaseous method can prepare a variety of semiconductor nanoparticles without the surface ligand capping and oxidation effects often observed for colloidally prepared nanoparticles that can inhibit charge transfer or cause self-doping. X-ray photoelectron spectroscopy, transmission electron microscopy, and high-angle annular dark-field scanning transmission electron microscopy were used to determine that 2.3 ± 0.4 nm Cu2-XS nanoparticles with copper in the +1 oxidation state were deposited into pentacene films. In low energy ion beam irradiation, nanocone and nanoripple arrays were prepared on Si surfaces by grazing incidence irradiation with 1 keV Ar+ ion beams that simultaneously sputtered away surface atoms and sputter-deposited metal impurity atoms from adjacent targets (K. Steeves Lloyd, et al. Surf. Sci., 2016, http://dx.doi.org/10.1016/j.susc.2016.03.016). Scanning electron microscopy and atomic force microscopy observed that when Si, Cu, or stainless steel was employed as a co-sputtering target, only stainless steel was found to assist the growth of dense arrays of nanocones. The structural characterization of samples further correlated the role of incident ion fluences on the formation of nanoripples vs. nanocones. Characterization of sample chemical composition by total reflection X-ray fluorescence and X-ray photoelectron spectroscopy revealed that the concentration of metal impurities originating from stainless steel (Fe, Cr and Ni) was relatively high in the regions with high density of nanocones and much lower in the region of nanoripples. Overall, these two strategies open up multiple possibilities for the preparation of complex nanostructures on surfaces and in thin films that are compatible with more common lithographic strategies.