AVS 63rd International Symposium & Exhibition
    2D Materials Focus Topic Thursday Sessions
       Session 2D-ThP

Paper 2D-ThP5
Selective Molecular attachment for 3D Printing of 2D Circuits

Thursday, November 10, 2016, 6:00 pm, Room Hall D

Session: 2D Materials Poster Session
Presenter: Wenbi Lai, University of Dayton
Authors: A.T. Juhl, Air Force Research Laboratory
N.R. Glavin, Air Force Research Laboratory
G.M. Leuty, Air Force Research Laboratory
R.J. Berry, Air Force Research Laboratory
R.R. Naik, Air Force Research Laboratory
M.F. Durstock, Air Force Research Laboratory
E.M. Heckman, Air Force Research Laboratory
R.S. Aga, Air Force Research Laboratory
E.B. Kreit, Air Force Research Laboratory
W. Lai, University of Dayton
C. Muratore, University of Dayton
Correspondent: Click to Email

Recently, we utilized phage display techniques to identify peptides that selectively bind to 2D targets such as electrically conductive graphene and semiconducting MoS2 in the forms of micro-scale fine powder, bulk crystals, and ultra-thin films (<1.5-5 nm). To examine the nature of peptide binding to these materials, we produced different ‘inks’ comprised of peptide molecules known to selectively bind to each material in solvents for printing on diverse surfaces including SiO2, gold, and PDMS. Each ink only binds to one type of particle (graphene or MoS2). We then exposed the substrates printed with peptides to suspensions of 2D particles.The particles demonstrate strong binding to the printed peptide surfaces, demonstrating a new scalable technique for large area device fabrication from 2D materials on diverse surfaces. To further understand peptide-MoS2 surface binding mechanisms, molecular dynamics simulations employing a newly developed atomic force field predicting the surface energy of MoS2 films were conducted. Integration of binding peptides into the model in conjunction with experimental results promote fundamental understanding of molecular interactions with MoS2 and other TMD materials for development of novel sensors and devices.