AVS 62nd International Symposium & Exhibition
    Thin Film Thursday Sessions
       Session TF+AS+NS+SA-ThA

Paper TF+AS+NS+SA-ThA2
Comparison of Solution Based Aluminum Oxide Phosphate Thin Films Deposited via Spin Coating vs. a Novel Mist Deposition System

Thursday, October 22, 2015, 2:40 pm, Room 111

Session: Thin Film: Growth and Characterization, Optical and Synchrotron Characterization II
Presenter: Nishit Murari, Oregon State University
Authors: N. Murari, Oregon State University
R.H. Mansergh, Oregon State University
Y. Huang, Oregon State University
G. Westerfield, Oregon State University
D. Keszler, Oregon State University
J.F. Conley, Oregon State University
Correspondent: Click to Email

Solution based spin coating techniques are well known for producing high quality organic as well as inorganic metal oxide thin films. However, spin coating is primarily suitable for planar substrates and lacks the ability to form uniform ultrathin films over large surface areas. In recent years, several alternative mist based deposition techniques have been introduced to enable solution based deposition over large areas and non-planar substrates. Mist deposition involves the creation of a precursor mist and its subsequent condensation on the substrate. Mist deposition techniques to date have been limited by disadvantages such as the requirement for highly volatile precursors and the non-homogeneous distribution of the mist, both of which lead to inferior film thickness uniformity. To address these limitations, we employ a new mist deposition system with a novel mist creation technique consisting of an atomizer with two opposing precursor jets. The unique opposing configuration of the atomizer enables the formation of a highly uniform mist even from low volatility precursors. In this work, we address the question of whether this new mist deposition technique can produce film quality comparable to spin coating technique.

Amorphous aluminum phosphate (AlPO) thin films were deposited via mist deposition using a BENEQ ACS 200-101 as well as standard spin coating. All films were deposited at room temperature and pressure using precursors based on aqueous suspensions of aluminum phosphate inorganic clusters. The inorganic ligands decompose at low temperature with minimal volume change presenting a route to high density films at low temperature. Both mist and spin coating achieve thickness uniformity of 5% across a 150 mm Si substrate. Both techniques result in ultra-smooth films with average surface roughness of less than 1 nm RMS. Variation in film density and roughness as a function of annealing temperature was identical for both techniques. Finally, similar charge transport behavior and dielectric constant were exhibited as a function of anneal temperature.

An aqueous precursor was used in a side by side comparison of spin coating and a novel mist deposition technique. High quality AlPO thin films of similar uniformity, density, roughness, and electrical properties were obtained using both techniques. Based on these results, this novel mist based deposition technique appears to be a promising candidate for the next generation of thin film deposition techniques for large area electronics.