AVS 62nd International Symposium & Exhibition
    Surface Science Thursday Sessions
       Session SS+AS+EM+EN-ThA

Paper SS+AS+EM+EN-ThA3
Insights into the Oxidation of Stepped Cu Surfaces using Multiscale Investigations

Thursday, October 22, 2015, 3:00 pm, Room 113

Session: Atomistic Modeling of Surface Phenomena & Semiconductor Surfaces and Interfaces - II
Presenter: Judith Yang, University of Pittsburgh
Authors: Q. Zhu, University of Pittsburgh
W.A. Saidi, University of Pittsburgh
J.C. Yang, University of Pittsburgh
Correspondent: Click to Email

Surface defects can induce non-canonical oxidation channels on metal surfaces that may lead to the formation of novel nanostructures. Recently, in situ environmental transmission electron microscopy (ETEM) experiments showed that the oxidation of stepped Cu surfaces promotes the formation of a flat metal-oxide interface through Cu adatoms detachment from steps and diffusion across the terraces. To bridge the gap between experiments and theory, we are investigating Cu oxidation using a multiscale computational approach. Our previous MD simulations based on a reactive force field (ReaxFF) demonstrated that the oxidation of stepped Cu(100) takes place on the upper terrace at a faster rate than the lower terrace due to a preferable oxygen diffusion from the lower to upper terraces. We have extended this study using first-principles density functional theory (DFT) and kinetic Monte Carlo (KMC), and performed a systematic study of all stepped Cu surfaces with a low Miller index. The DFT results show that the oxygen diffusion trend varies with the surface type, where in most cases the oxygen ascending diffusion is more favored. This result is confirmed also with ReaxFF MD and KMC simulations. The MD simulations, with a fine-tuned ReaxFF force field parametrization, have also indicated that oxygen adatoms on the upper terrace can enhance the interlayer Cu atom mass transport. These theoretical simulations provide essential fundamental understanding of the experimentally observed smoothing of the Cu surface during in situ oxidation.