| AVS 62nd International Symposium & Exhibition | |
| MEMS and NEMS | Tuesday Sessions |
| Session MN+MG-TuM |
| Session: | Multiscale Phenomena & Interactions in Micro- and Nano-Systems (8:00-10:00 am) & Optical MEMS/NEMS, Photonics, and Quantum Nanosystems (11:00 am-12:20 pm) |
| Presenter: | Connor Smith, The University of Alabama |
| Authors: | C. Smith, The University of Alabama Y. Feng, The University of Alabama S.L. Burkett, The University of Alabama |
| Correspondent: | Click to Email |
The use of Solder Based Self-Assembly (SBSA) in fabricating 3D structures on the microscopic scale is a process with numerous potential applications. This method involves creating copper plated 2D flat patterns of various shapes on a silicon substrate. Then, upon dip soldering these patterns and re-flowing the solder with hydrochloric acid, surface tension pulls up on these shapes to form a 3D structure. However, the use of a SiO2 sacrificial layer in performing this method results in the need for hydrofluoric acid (HF) during the etching phases, which has many dangerous hazards associated with it. The goal of this research is to develop a new process in which a water-soluble polymer, poly-acrylic acid (PAA), may be used as a sacrificial layer instead of SiO2--thus making the micro-fabrication process much safer. By working through the original SBSA method, and overcoming the various obstacles created by needing to protect the PAA from being exposed to water earlier than desired, an effective procedure has been developed. Through completing this project, future attempts to fabricate microscopic 3D structures using the SBSA method will be safer and less prone to dangerous HF exposure. Furthermore, removing HF etching from the procedure will reduce the time required to move through the process as a whole, thus increasing its efficiency.