AVS 62nd International Symposium & Exhibition
    MEMS and NEMS Tuesday Sessions
       Session MN+MG-TuM

Paper MN+MG-TuM3
Introducing Students to MEMS: A Practical Process for the Fabrication and Testing of Piezoresistive Cantilevers

Tuesday, October 20, 2015, 8:40 am, Room 211A

Session: Multiscale Phenomena & Interactions in Micro- and Nano-Systems (8:00-10:00 am) & Optical MEMS/NEMS, Photonics, and Quantum Nanosystems (11:00 am-12:20 pm)
Presenter: Frederic Loizeau, Stanford University
Authors: F. Loizeau, Stanford University
E. Sadeghipour, Stanford University
T. Larsen, Stanford University
J.Y. Sim, Stanford University
C. Roozeboom, Stanford University
E. Mazzochette, Stanford University
B.L. Pruitt, Stanford University
Correspondent: Click to Email

We present a laboratory course to introduce students to Micro-Electro-Mechanical Systems (MEMS) through fabrication and characterization of piezoresistive cantilevers. We developed a process flow comprised of only three photolithography steps to minimize time spent by the students in the cleanroom and workload of the teaching team. Students performed hands-on work on over 80% of the fabrication process and thus earned qualification status to operate the standard tools in our cleanroom. The course included practical experience with signal conditioning, noise, and sensitivity measurements. The lab component spanned six sessions of 4.5 hours each and is ideal for integration in a lecture course or a two-week standalone mini-course.

The hands-on laboratory component was paired with lectures covering cleanliness, process selection, and device design and characterization. Six lab sessions of 4.5 hours each covered the fabrication and characterization of piezoresistive cantilevers. In each session, teams of five students learned fundamental MEMS processes and equipment use while fabricating pre-designed devices. Weekly homework reinforced design, process, and testing concepts, e.g., predicting device performance, completing lithography steps, or building a measurement circuit. Device fabrication was completed in the first four lab sessions. Modest process support was provided outside of class by the teaching team for batch processes such as wafer preparation, metallization, and final HF release. The yield of the fabrication process was >90%. Each team built their own Wheatstone bridge and amplifier circuit to readout the piezoresistor signal prior to lab sessions 5 and 6 for device characterization. In session 5 they learned to use a dynamic signal analyzer to measure the Hooge and Johnson noise. In session 6, the students measured the power spectral density of cantilever tip deflection due to thermomechanical noise using a laser-Doppler vibrometer (LDV). From these measurements, they estimated the spring constants, resonant frequencies and quality factors of the cantilevers. Using a piezoelectric shaker and the LDV, students simultaneously measured the cantilever deflection and the piezoresistor bridge output and then used this to calculate cantilever sensitivity and resolution. Finally, experimental measurements were compared with theoretical predictions.