AVS 62nd International Symposium & Exhibition
    Electronic Materials and Processing Thursday Sessions
       Session EM-ThM

Invited Paper EM-ThM5
Status Update on a New Class of Solution Processable Low-k Dielectric Coatings for Use as ILD with K < 2.4

Thursday, October 22, 2015, 9:20 am, Room 211C

Session: Interconnects II
Presenter: Hash Pakbaz, SBA Materials
Authors: H. Pakbaz, SBA Materials
N. Hacker, SBA Materials
Z. Tokei, IMEC, KU Leuven Belgium
M. Baklanov, IMEC, KU Leuven Belgium
Correspondent: Click to Email

Liquid Phase Self Assembly (LPSA) is used as a unique approach to create porous carbon-doped SiOx solution processable coatings. In this approach, self assembling organic template, in a solution consisting of various silanes and other additives, form nano-particles. These nano-particles are the basis for pore formation in the final coated film where-by to minimize the over-all energy of the system, the nano-particles tend to maximize their respective distances in solution and during the coating process. Thin films are coated using spin coating and the templates are removed by thermal curing or UV curing the coated film without pore collapse. This leads to formation of “ordered” porous coatings where pore overlap does not occur until high levels of porosity (> 60%) are introduced. As a result, low-k dielectric coatings with k values below 2.0 can be achieved with excellent mechanical properties. In this paper, fundamental properties of LPSA low-k dielectric, integration results in advanced node BEOL dual-damascene structures as well as solution storage lifetime consistent with meeting requirements for production are presented.