AVS 61st International Symposium & Exhibition | |
Helium Ion Microscopy Focus Topic | Thursday Sessions |
Session HI+2D+AS+MC-ThA |
Session: | Nanoengineering with Helium Ion Beams |
Presenter: | Shinichi Ogawa, NeRI, AIST, Japan |
Correspondent: | Click to Email |
Several unique applications of a helium ion microscopy (HIM) technology have been studied. In comparison with electron, helium ion has larger cross section, and it realized HIM observation with less current because of higher efficiency of secondary electron generation with maximum distribution energy of 1 eV [1], a few eV in a SEM case, for imaging, which results in less power implant (less thermal damage input) into samples. Utilizing these features, a low dielectric constant material pattern of 70 nm line with less deformation (thermal damage) and a Cu metal line underneath a 130 nm dielectric of band gap of a few eV were imaged [2]. Luminescence from a SiO2 sample was detected at imaging conditions [3], in which no damage was observed by a transmission electron microscopy (TEM) - electron energy loss spectroscopy method [4]. As one of nano-fabrication applications, we found that a helium ion irradiation using the HIM functionalizes a gate control of carrier conduction in a single-layer graphene at an appropriate amount of helium ion dose to graphene which enable gate bias control of current with an on-off ratio of two orders of magnitude at room temperature [5], [6]. A few nm diameter tungsten particles were deposited onto a TEM sample under the helium ion beam irradiation in W(CO)6 gas atmosphere with high special resolution accuracy, which realized precise electron tomography and re-construction [7], and tungsten pillars of a few um height with 40 nm diameter were formed with a straight hole of a few nm diameter through a center of the pillars [8]. The research on graphene material is granted by JSPS through FIRST Program initiated by CSTP.
References: [1] Y. V. Petrov, O.F. Vyvenko, and A. S. Bondarenko, J. Surface Investigation, 792 (2010), [2] S. Ogawa, W. Thompson, L. Stern, L. Scipioni, L. Notte, L Farkas, and L. Barriss, Jpn. J. Appl. Phys., 49 04DB12 (2010), [3] S. Ogawa, T. Iijima, S. Awata, S. Kakinuma, and T. Kanayama, Proc. of International Interconnect Technology Conference (2011), [4] Y. Otsuka, Y. Shimizu, N. Kawasaki, S. Ogawa, and I. Tanaka, Jpn. J. Appl. Phys., 49 111501 (2011), [5] S. Nakaharai, T. Iijima, S. Ogawa, H. Miyazaki, S. Li, K. Tsukagoshi, S. Sato, and N. Yokoyama, Appl. Phys. Express, 5 015101 (2012), [6] S. Nakaharai, T. Iijima, S. Ogawa, S. Suzuki, S. Li, K. Tsukagoshi, S. Sato, N. Yokoyama, ACS Nano, 7 (2013) 5694-5700, [7] M. Hayashida, T. Iijima, T. Fujimoto and S. Ogawa, Micron 43, 992-995 (2012), [8] K. Kohama, T. Iijima, M. Hayashida, and S. Ogawa, J. Vac. Sci.Technol. B 31 (3), 031802 (2013)