AVS 61st International Symposium & Exhibition | |
Electronic Materials and Processing | Monday Sessions |
Session EM+MI+NS-MoM |
Session: | Complex Oxides and Their Interfaces |
Presenter: | Thong Ngo, The University of Texas at Austin |
Authors: | T.Q. Ngo, The University of Texas at Austin M.D. McDaniel, The University of Texas at Austin S.N. Chopra, The University of Texas at Austin J.G. Ekerdt, The University of Texas at Austin A.B. Posadas, The University of Texas at Austin A.A. Demkov, The University of Texas at Austin |
Correspondent: | Click to Email |
Gemanium, which exhibits higher hole and electron mobilities than silicon, might become a candidate to replace silicon as a channel material in a field effect transistor (FET) beyond the 3D FET generation. Unlike Si, when the high-κ dielectrics are integrated on Ge, the chemical instability of GeO2 is an advantage. Moreover, the instability of GeO2 also enables epitaxial functional oxides on Ge. Crystalline perovskites can be high-κ insulating, with many also being ferromagnetic, ferroelectric, multiferroic, or superconducting. This wide range of properties, combined with possibilities for lattice match to Ge(001), allows for multi-functional oxides to be engineered on Ge(001).
Epitaxial integration of ferroelectric barium titanate, BaTiO3 (BTO), on Ge has attracted much attention due to the low lattice mismatch between Ge(001) and BTO (0.25% above Curie temperature, Tc = 120 °C). The efforts to epitaxially integrate ferroelectric BTO on Ge(001) have been demonstrated using molecular beam epitaxy (MBE) by several groups. However, for device manufacturing applications, atomic layer deposition (ALD) has advantages over MBE due to its high step coverage, significantly low thermal budget, scalability, and low cost.
We demonstrate an all-chemical route to epitaxially integrate BTO directly on Ge(001). Amorphous BTO films were grown on the 2×1 reconstructed, clean Ge(001) surface at 225 °C using ALD. Barium bis(triisopropylcyclopentadienyl), titanium tetraisopropoxide, and water were employed as co-reactants. The films become highly crystalline after a vacuum anneal at 600–700 °C. In-situ x-ray photoelectron spectroscopy confirms the stoichiometry of the BTO films with no detectable GeOx formation or carbon incorporation. In-situ reflection high energy electron diffraction (RHEED) shows high order of BTO film crystallinity after vacuum annealing. X-ray diffraction (XRD) is used to determine the crystallinity and the orientation of BTO films. Electrical characterization, including capacitance-voltage, leakage current, interface trap density, and piezoresponse force microscopy measurements will also be performed to explore the high-κ insulating and ferroelectric properties of BTO films on Ge(001). The integration of BTO films on Ge(001) by ALD is a promising method for fabricating a ferroelectric FET at production scale.