| AVS 60th International Symposium and Exhibition | |
| MEMS and NEMS | Tuesday Sessions |
Click a paper to see the details. Presenters are shown in bold type.
| MN-TuP1 Analysis of Convective Performance in Confined Droplets with Various Working Fluids and Substrates for Polymerase Chain Reaction Applications P.L. Chen, C.S. Yu, C.C. Yang, Y.H. Lin, Y.H. Tang, M.H. Shiao, C.-N. Hsiao, National Applied Research Laboratories, Taiwan, Republic of China |
| MN-TuP2 The Study of Convex Corner Compensation for Dry Anisotropic Etching of Single Crystal Silicon in ICP-RIE Y.H. Lin, Y.H. Tang, ITRC, NARL, Taiwan, Republic of China, W. Hsu, NCTU, Taiwan, Republic of China, P.-L. Chen, C.C. Yang, M.-H. Shiao, C.-N. Hsiao, ITRC, NARL, Taiwan, Republic of China |
| MN-TuP3 Micro Fabrication on Quartz Glass by Inductively Coupled Plasma-reactive Ion Etching and its Optical Application Y.H. Tang, Y.H. Lin, P.-L. Chen, M.-H. Shiao, C.-N. Hsiao, ITRC, NARL, Taiwan, Republic of China |
| MN-TuP4 Finite Element Model Verification of High Frequency Piezoelectric Contour-Mode MEMS Resonators Using Laser Vibrometry K.R. Qalandar, B.A. Gibson, L.A. Shaw, S.Y. Chiu, University of California, Santa Barbara, A. Tazzoli, J. Segovia, Carnegie Mellon University, M. Rinaldi, Northeastern University, G. Piazza, Carnegie Mellon University, K.L. Turner, University of California, Santa Barbara |
| MN-TuP5 Phase Noise-Based Bifurcation Sensing of Nonlinear MEMS Cantilevers L. Li, L.A. Shaw, K.L. Turner, University of California, Santa Barbara |
| MN-TuP6 Simulation Study of Processing Parameters for Solder Filled Self Assembled 3D Micro-scale Structures N. Oraon, International Institute of Information Technology, India, J.C. Lusth, S.L. Burkett, The University of Alabama, M. Rao, International Institute of Information Technology, India |