AVS 60th International Symposium and Exhibition
    Tribology Focus Topic Tuesday Sessions
       Session TR-TuP

Paper TR-TuP5
Effects TiN and TaN Barrier Layers on the Emergence of Ag and Cu Particles and the Subsequent Mechanical and Antibacterial Properties of TaN-(Ag,Cu) Nanocomposite Films

Tuesday, October 29, 2013, 6:00 pm, Room Hall B

Session: Tribology Poster Session
Presenter: Y.H. Lie, Ming Chi University of Technology, Taiwan, Republic of China
Authors: J.H. Hsieh, Ming Chi University of Technology, Taiwan, Republic of China
Y.R. Cho, Ming Chi University of Technology, Taiwan, Republic of China
Y.H. Lie, Ming Chi University of Technology, Taiwan, Republic of China
Correspondent: Click to Email
TaN–(Cu,Ag) nanocomposite films were deposited by reactive co-sputtering on Si(001) and M2 tool steels. Prior to annealing, the films were deposited with a barrier layer of TiN or TaN (with various thickness) in order to control the amount of emerged Ag and Cu particles. As a result, the tribological and anti-bacterial behaviors can be controlled. The films were then annealed using RTA (Rapid Thermal Annealing) at 200 °C–400 °C to induce the nucleation and growth of metal particles. Thes films’ structures, surface morphologies, and mechanical properties were analyzed. The samples were tested for their anti-wear and anti-bacterial behaviors against Gram-negative Escherichia coli, as function of barrier layer thickness. It is found that, through the application of diffusion barrier, the antibacterial efficiency against E. coli as well as the tribological properties can be changed and controlled, depending on the layer thickness of TiN and TaN. In general, the films with TiN layer tended to allow more Ag and Cu particles to form on the surface.