| AVS 60th International Symposium and Exhibition | |
| Thin Film | Tuesday Sessions |
| Session TF-TuM |
| Session: | ALD for Emerging Applications |
| Presenter: | J. Clancey, University of Colorado, Boulder |
| Authors: | J. Clancey, University of Colorado, Boulder J. Yin, University of Colorado, Boulder L. Baker, University of Colorado, Boulder A.S. Cavanagh, University of Colorado, Boulder S.M. George, University of Colorado, Boulder |
| Correspondent: | Click to Email |
The use of atomic layer deposition (ALD) to coat large quantities of particles with conformal thin films is important for many applications. One area that has received recent attention is the efficient deposition of precious catalytic metals such as Pt. The ALD of catalytic metals is particularly challenging because of nucleation difficulties. However, recent studies have shown that plasma-assisted ALD can improve the nucleation and leads to much more conformal metal films after fewer ALD cycles. In this work, a new open-ended rotary ALD reactor design is presented that combines particle agitation in a rotary reactor with a remote inductively coupled plasma (ICP) plasma source. The plasma enters the open end of the rotary reactor with line-of-sight to the particles tumbling in the rotary reactor. A gate valve can separate the ICP plasma source from the open-ended rotary reactor during the metal precursor exposures. This design allows metals to be deposited on the particles without affecting the ICP plasma source. Results will be presented for Al2O3 ALD and W ALD on TiO2 particles. Pt ALD on the TiO2 particles will also be demonstrated using the W ALD adhesion layer to promote rapid Pt ALD nucleation and conformal film growth. This procedure was described earlier in L. Baker et al., Appl. Phys. Lett.101, 111601 (2012).