Paper TF-ThA8
A Novel Method of Managing Joint Stress, in a Metallic Bond Made Using Reactive Multilayer Foils, at a User Selected Temperature

Thursday, October 31, 2013, 4:20 pm, Room 102 C

Previously we have presented a joining method whereby materials of widely differing CTE were successfully bonded with no deformation at room temperature using reactive multilayer foils as the local heat source. This is unique in as far as creating a metallic bond with any other technique results in significant deformation upon cooling back to room temperature. For many large area applications this deformation results in having to use mechanical methods to flatten these surfaces to their original shape, which is highly undesirable as such techniques are unpredictable and do cause yield loss when used. When reactive multilayer foils are used in the bonding process, no such deformation of materials occurs resulting in assemblies that can be effectively used as soon as they are bonded.

Critical to the use of parts at higher temperature is the need to minimize/manage joint stress in assemblies at a particular application temperature. This paper will demonstrate how this can be done effectively, with the use of a reactive multilayer foil in creating the bond.