AVS 60th International Symposium and Exhibition
    Thin Film Thursday Sessions
       Session TF+AS+EM+NS+SS-ThM

Paper TF+AS+EM+NS+SS-ThM12
TiO2 Film Crystallization by Post-Deposition Annealing

Thursday, October 31, 2013, 11:40 am, Room 104 A

Session: Thin Film: Growth and Characterization I
Presenter: A. Henegar, University of Maryland, Baltimore County
Authors: A. Henegar, University of Maryland, Baltimore County
T. Gougousi, University of Maryland, Baltimore County
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Optical and electrical properties of TiO2 thin films are largely effected by film morphology. TiO2 usually crystallizes into anatase or rutile phase. The rutile phase is generally stable while the anatase phase is difficult to produce in pure form through annealing. TiO2 thin films were grown by atomic layer deposition (ALD) on Si (100) surfaces using tetrakis(dimethylamino) titanium (TDMAT) and H2O. Films were grown at every 50°C increment from 100 to 300°C approximately 100 nm thick, determined by nominal growth rates derived from spectroscopic ellipsometry (SE) measurements. The growth rate varied from 0.4Å/cycle at the ALD optimal temperature of 200°C to 1.2Å/cycle at 300°C. Films were annealed post-deposition at temperatures of 500°C, 700°C and 900°C for 3, 5 and 10 minutes in an argon environment using a rapid thermal annealer. Characterization was completed using Fourier transform infrared spectroscopy (FTIR), X-ray diffraction (XRD), scanning electron microscopy (SEM), transmission electron microscopy (TEM) and atomic force microscopy (AFM). FTIR measurements indicate that the as-deposited films have an amorphous structure. Annealed films exhibit various crystallization to rutile phase, anatase phase, or a mixture of the two phases, depending on the deposition and post-deposition annealing conditions, as confirmed by XRD. Specifically, TiO2 films grown at 100°C and annealed for 10 minutes at 900°C exhibit only amorphous and anatase phase TiO2. It is shown that TiO2 crystallinity can be tuned between amorphous, anatase and rutile phases by controlling the deposition temperature and post-deposition annealing parameters.