| AVS 60th International Symposium and Exhibition | |
| Manufacturing Science and Technology | Monday Sessions |
| Session MS+AS+EM+NS+PS+TF-MoA |
| Session: | IPF 2013-Manufacturing Challenges for Emerging Technologies: III. Manufacturing Challenges: Electronics |
| Presenter: | R. Gronheid, IMEC, Belgium |
| Authors: | R. Gronheid, IMEC, Belgium P.A. Rincon Delgadillo, University of Chicago T.R. Younkin, Intel Corporation B.T. Chan, IMEC, Belgium L. Van Look, IMEC, Belgium I. Pollentier, IMEC, Belgium P.F. Nealey, University of Chicago |
| Correspondent: | Click to Email |
Directed Self-Assembly (DSA) of block copolymers (BCP) is based on nano-scale phase separation. Depending on the relative volume fraction of the blocks, different morphological structures may form in the bulk of these materials. In the case of di-block copolymers, specifically the lamellar and cylindrical phase provide structures that may be used to form line/space and hole-type patterns, respectively. When thin films of BCPs are applied on substrates that provide a pre-pattern to guide the assembly process, the orientation and direction of the resulting structures can be controlled. DSA has gained significant attention as a next method for mainstream nano-fabrication in a time span of just a few years. The primary interest in the DSA technology includes the inherent variability control (since dimension is controlled through the polymer molecular weight) and the high pattern densities (typical length scales are on the order of 3-50nm) that are accessible. The outstanding questions that need to be answered in order to prove readiness of DSA for semiconductor manufacturing include defectivity, pattern transfer capabilities, pattern placement accuracy, design rule restrictions that are imposed by DSA and demonstration in an electrically functional device.
At imec, DSA based patterning has been implemented on 300mm wafers in various process flows that are compatible with semi-conductor manufacturing. These flows have been used as test vehicles to study the above-mentioned issues. In this paper, an overview will be given of the main recent accomplishments from the imec DSA program.