AVS 60th International Symposium and Exhibition
    Manufacturing Science and Technology Monday Sessions
       Session MS+AS+EM+EN+NS+TF-MoM

Invited Paper MS+AS+EM+EN+NS+TF-MoM5
Conformal Thin Films- The Use of Atomic Layer Deposition in Energy Related Applications

Monday, October 28, 2013, 9:40 am, Room 202 B

Session: IPF 2013-Manufacturing Challenges: R&D Perspective (8:20-9:40 am) / Energy Storage (9:40 am-12:00 pm)
Presenter: G.M. Sundaram, Ultratech/Cambridge NanoTech
Correspondent: Click to Email

Atomic Layer Deposition (ALD) is a unique thin film deposition technique based on sequential precursor usage with self-limiting reactions, which yields films with excellent uniformity, density, conformality, and interface quality . This is turn has set the stage for its use in a wide array of technology areas. In this work, the principles of ALD will be covered, along with an examination of the intersection points between ALD and a number energy related structures - including storage devices.