AVS 60th International Symposium and Exhibition
    Manufacturing Science and Technology Tuesday Sessions
       Session MS+AS+BA+BI+PS+TF-TuM

Invited Paper MS+AS+BA+BI+PS+TF-TuM3
Challenges in the Fabrication of Nanoscale Devices for DNA Base Sensing

Tuesday, October 29, 2013, 8:40 am, Room 202 B

Session: IPF 2013-Manufacturing Challenges for Emerging Technologies: IV. Manufacturing Challenges: The Life Sciences
Presenter: S. Papa Rao, IBM Research Division, T.J. Watson Research Center
Authors: S. Papa Rao, IBM Research Division, T.J. Watson Research Center
J. Bai, IBM Research Division, T.J. Watson Research Center
E.A. Joseph, IBM Research Division, T.J. Watson Research Center
R.L. Bruce, IBM Research Division, T.J. Watson Research Center
M. Lofaro, IBM Research Division, T.J. Watson Research Center
M. Krishnan, IBM Research Division, T.J. Watson Research Center
M. Brink, IBM Research Division, T.J. Watson Research Center
M. Guillorn, IBM Research Division, T.J. Watson Research Center
S.M. Rossnagel, IBM Research Division, T.J. Watson Research Center
Q. Lin, IBM Research Division, T.J. Watson Research Center
J. Cotte, IBM Research Division, T.J. Watson Research Center
C. Jahnes, IBM Research Division, T.J. Watson Research Center
Smith, IBM Research Division, T.J. Watson Research Center
Gignac, IBM Research Division, T.J. Watson Research Center
Reuter, IBM Research Division, T.J. Watson Research Center
Nam, IBM Research Division, T.J. Watson Research Center
Astier, IBM Research Division, T.J. Watson Research Center
Wang, IBM Research Division, T.J. Watson Research Center
Stolovitsky, IBM Research Division, T.J. Watson Research Center
Goldblatt, IBM Research Division, T.J. Watson Research Center
Correspondent: Click to Email
The fabrication of integrated circuits with increasingly fine geometries has required the development of advanced process technologies, which can be further refined for the purpose of building devices for biological applications. Applications such as sensing nucleotides in DNA require structures that are of the order of a few nanometers. This talk will focus on the specific challenges encountered in the fabrication of such nano-scale devices – broadly classified into materials-related challenges, unit-process challenges and process integration-related challenges. Issues such as dielectric integrity, metal recrystallization, and materials compatibility with chemistries used down-stream will be discussed. Dimension control during fabrication of ~10 nm sized structures was achieved through intense process development efforts of reactive ion etch and chemical mechanical planarization (both manufacturing-friendly techniques). Device layout issues that affect manufacturability will be presented. Finally, some of the important lessons learned in achieving a high yield of reliable devices through process-integration changes will also be discussed.