AVS 60th International Symposium and Exhibition
    Electronic Materials and Processing Friday Sessions
       Session EM+NS+TF-FrM

Paper EM+NS+TF-FrM6
High Performance Infrared Sensing Using Colloidal Quantum Dots Monolithically Integrated with a Silicon Readout IC

Friday, November 1, 2013, 10:00 am, Room 102 A

Session: Nanoelectronic Interfaces, Materials, and Devices/Crystalline Oxides on Semiconductors
Presenter: J.S. Lewis, RTI International
Authors: J.S. Lewis, RTI International
E.J.D. Klem, RTI International
C.W. Gregory, RTI International
G.B. Cunningham, RTI International
S. Hall, RTI International
D.S. Temple, RTI International
A. D'Souza, DRS Sensors and Targeting Systems
E. Robinson, DRS Sensors and Targeting Systems
N. Dhar, Darpa, Mto
P.S. Wijewarnasuriya, Army Research Laboratories
Correspondent: Click to Email
Low cost is frequently cited as a driver for hybrid and organic electronic devices, but in fact very few applications allow a sacrifice in performance. Here we present a hybrid organic/inorganic device that rivals high performance InGaAs detectors for short wave infrared (SWIR) imaging, and show that the hybrid devices based on colloidal quantum dots (CQDs) offer substantial benefits with respect to wavelength range, integration with Si readout integrated circuits (ROICs), and of course cost. We will present the results for detectors fabricated on passive Si substrates as well as for 320 x 10 arrays fabricated on ROICs. We will discuss recent advances in device architecture and processing that resulted in measured dark currents of 3 nA/cm2 at room temperature, with sensitivity to 1.7 µm. We will show other devices with spectral sensitivity that extends from UV to 2.2 µm. For the ROIC-integrated devices we will show dark currents <10 nA/cm2. The most significant advantage of the CQD technology is ease of fabrication. The devices are fabricated directly onto the ROIC substrate at low temperatures compatible with ROICs, and arrays can be fabricated at wafer scale. This combination of high performance, dramatic cost reduction, and multi-band sensitivity makes the technology attractive for a variety of applications, which we will discuss.