AVS 59th Annual International Symposium and Exhibition
    Thin Film Wednesday Sessions

Session TF-WeM
Thin Films for Encapsulation, Packaging, and Biomedical Devices

Wednesday, October 31, 2012, 8:00 am, Room 10
Moderator: L.W. Rieth, University of Utah


  Click here to Download program book for this session  
  in Adobe Acrobat format  

Click a paper to see the details. Presenters are shown in bold type.

8:00am TF-WeM1
Optimizing a Spatial Atomic Layer Deposition Cell for High Throughput, Low Temperature, Roll-to-Roll Applications
M.J. Dalberth, L. Lecordier, M.J. Sershen, M. Ruffo, R. Coutu, G. Sundaram, J.S. Becker, Cambridge Nanotech, Inc.
8:20am TF-WeM2
Encapsulation of Implantable Devices by Atomic Layer Deposited Al2O3 and Parylene C Bi-layer
X. Xie, L.W. Rieth, F. Solzbacher, University of Utah
8:40am TF-WeM3 Invited Paper
Ultra-barrier Technology for Moisture-Sensitive Electronics
P.F. Carcia, DuPont Central Research and Development
9:20am TF-WeM5
Multilayer Barrier Coatings for Organic Photovoltaics
A.M. Coclite, F. De Luca, K.K. Gleason, Massachusetts Institute of Technology
9:40am TF-WeM6
Preparation of Hydrophobic Coatings on Si/SiO2 by Incorporation of Nano- and Microdiamond in a Layer-By-Layer Deposition
A. Diwan, J. Wilcock, M.R. Linford, Brigham Young University