AVS 59th Annual International Symposium and Exhibition
    Thin Film Wednesday Sessions
       Session TF+SE+NS-WeM

Paper TF+SE+NS-WeM11
Through-post Electrical Characterization of GLAD Thin Films

Wednesday, October 31, 2012, 11:20 am, Room 11

Session: Glancing Angle Deposition (GLAD)
Presenter: A. Lalany, University of Alberta, Canada
Authors: A. Lalany, University of Alberta, Canada
R.T. Tucker, University of Alberta, Canada
M.T. Taschuk, University of Alberta, Canada
M.D. Fleischauer, University of Alberta and The National Institute for Nanotechnology, Canada
M.J. Brett, University of Alberta, Canada
Correspondent: Click to Email

Glancing Angle Deposition (GLAD) [1] thin films are increasingly used in optoelectronic applications that benefit from their unique optical properties or ultra-high surface area. GLAD produces porous nanostructured thin films which have found applications as high surface area electrodes. Potential performance benefits of these nanostructured thin-films for optoelectronic devices include, but are not limited to, increased charge extraction [2]. Suitable electrical conductivity along the length of GLAD structures (normal to substrate plane) is necessary to exploit a GLAD film’s high surface area for electronic devices. However, optimization of GLAD films for these devices has proven difficult without direct measurements of post resistivity.
In-plane resistivity measurements of metals and conductive oxide GLAD films have been performed [3-5], showing increasing in-plane resistivity with increasing oblique deposition angle (due to decreased film density resulting in fewer conductive pathways). Electrical anisotropy has also been observed, with differing in-plane resistivity for different nanocolumn orientations [3-5]. Through post conductivity measurements present additional challenges - it has been shown that as crystallite grain size approaches the range of bulk electron mean free path, column-boundary scattering effects begin to dominate standard bulk-scattering mechanisms [6]. As such, the extensive boundaries present in GLAD structures can result in complex electrical behavior. While several attempts have been made to access through-post electrical properties, results have been limited to relative measures or are extremely low yield processes [7, 8].
We require a measurement technique that is both time and cost effective, statistically robust, and has high yield. This has been achieved with a Kelvin Cross-Bridge Resistor architecture specifically designed to measure through-post resistivity. Our devices can measure resistivities between 100 µΩ cm < ρ < 11 GΩ cm, and we have successfully measured through-post conductivities for Indium-tin-oxide (ITO) and Cr GLAD films. Here, we will present device fabrication, validation and current experimental results.
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[2] D.A. Rider et al., Nanotech. 22 (2007) 0857060.
[3] J. Lintymer et al., Surf. & Coat. Tech. 174-175 (2003) 316.
[4] K.D. Harris et al., Adv. Funct. Mater. 18 (2008) 2147.
[5] D. Vick et al., J. Vac. Sci. Technol. A 24 (2006) 156.
[6] A. Besnard et al., J. Phys. D: Appl. Phys. 44 (2001) 215301.
[7] M.F. Canslzoglu et al., ACS Nano. 4 (2010) 733.
 [8] S.P. Chiu et al., Nanotech. 20 (2009) 105203.