AVS 59th Annual International Symposium and Exhibition
    Electronic Materials and Processing Wednesday Sessions
       Session EM+TF-WeM

Invited Paper EM+TF-WeM1
Versatile Electron Beam Chemical Lithography on the Basis of Monomolecular Films

Wednesday, October 31, 2012, 8:00 am, Room 009

Session: Hybrid Electronic Materials and Interfaces
Presenter: M. Zharnikov, University of Heidelberg, Germany
Correspondent: Click to Email

The talk reviews recent progress in Electron Beam Chemical Lithography (EBCL) on the basis of monomolecular templates provided by self-assembled monolayers (SAMs). Due to the monolayer thickness of SAMs and molecular size of their structural building blocks, patterning down to few nanometers is in principle possible. Depending on the architecture of the SAM constituents, different EBCL strategies can be used [1]. In the case of aromatic backbone, selective modification of specific tail groups at the SAM-ambience interface can be exploited [1]. In the case of aliphatic backbone, irradiation-promoted exchange reaction between the molecules in the primary SAM and potential molecular substituents can be used [2]. A further promising technique within the EBCL framework is Electron Beam Activation Lithography which involves activation of the amino tail groups of the primary SAM template disabled by specific quencher moieties [3]. This method is especially useful for the fabrication of morphological patterns. EBCL can also be adapted for biological applications, based on protein-repelling templates [4]. One can either perform a direct writing in such a template, which can be both SAM-based and polymer-like, or apply irradiation-promoted exchange reaction with well-controlled parameters. Using the above techniques, chemical patterning and surface engineering on the length scale ranging from cm to nm can be performed. Not only simple dot or stripe structures, but complex gradient-like and biology-inspired patterns can be fabricated as will be demonstrated by representative examples.

[1] M. Zharnikov and M. Grunze, J. Vac. Sci. Technol. B 20, 1793-1807 (2002).

[2] N. Ballav, S. Schilp, and M. Zharnikov, Angew. Chem. Int. Ed. 47, 1421–1424 (2008).

[3] S. Schilp, N. Ballav, and M. Zharnikov, Angew. Chem. Int. Ed. 47, 6786-6789 (2008).

[4] N. Ballav, H. Thomas, T. Winkler, A. Terfort, and M. Zharnikov, Angew. Chem. Int. Ed. 48, 5833-5836 (2009); Nature, 460, 308 (2009).