| AVS 57th International Symposium & Exhibition | |
| Electronic Materials and Processing | Tuesday Sessions |
Click a paper to see the details. Presenters are shown in bold type.
| 8:00am | EM-TuM1 Resistivity Increase due to Electron Surface Scattering in Nanoscale Metal Films J.S. Chawla, D. Gall, Rensselaer Polytechnic Institute |
| 8:20am | EM-TuM2 Extracting Inelastic and Elastic Hot Electron Attenuation Lengths from nm-Thick Metal Films using BEEM J.J. Garramone, J.R. Abel, I.L. Sitnitsky, V.P. LaBella, University at Albany |
| 8:40am | EM-TuM3 Invited Paper Influence of Spontaneous Polarization and Intrinsic Gap States in Schottky Contacts to ZnO M.W. Allen, University of Canterbury, New Zealand, S.M. Durbin, University at Buffalo |
| 9:20am | EM-TuM5 Dynamics of the Charge Transfer through the Individual Molecules in Alkanethiolate Self-Assembled Monolayers P. Kao, Pennsylvania State University, S. Neppl, P. Feulner, Technische Universität München, Germany, D.L. Allara, Pennsylvania State University, M. Zharnikov, Universität Heidelberg, Germany |
| 9:40am | EM-TuM6 Electronic Properties and Assembly of Zinc Metalloporphyrin Islands on Au(111) Surfaces A.E. Schuckman, K.M. Webb, L.M. Perez, Texas A&M University, M. Jurow, Hunter College of the City University of New York, L.H. Yu, National Institute of Standards and Technology, C.M. Drain, Hunter College of the City University of New York, J.G. Kushmerick, National Institute of Standards and Technology, J.D. Batteas, Texas A&M University |
| 10:40am | EM-TuM9 Deposition of Nickel Nanostructures by Electroless Deposition on Micron-Scale Patterned SAMs Z. Shi, A.V. Walker, University of Texas at Dallas |
| 11:00am | EM-TuM10 Rapid DNA Sequencing via Transverse Electronic Transport M. Zwolak, Los Alamos National Laboratory, M. Di Ventra, University of California at San Diego |
| 11:40am | EM-TuM12 High Precision Local Electrical Probing: Potential and Limitations for the Analysis of Nanocontacts and Nanointerconnects A. Bettac, J. Koeble, B. Guenther, M. Maier, A. Feltz, Omicron NanoTechnology GmbH, Germany, D. Jie, N. Chandarsekhar, Institute of Materials Research & Engineering, Singapore, C. Joachim, CEMES-CNRS, France |