AVS 57th International Symposium & Exhibition
    Thin Film Tuesday Sessions
       Session TF-TuP

Paper TF-TuP5
Growth of Silicon-Germanium-Carbon Alloys Using Modified Laser Ablation

Tuesday, October 19, 2010, 6:00 pm, Room Southwest Exhibit Hall

Session: Thin Film Poster Session I
Presenter: J.G. Quiñones Galván, CINVESTAV-IPN, Mexico
Authors: J.G. Quiñones Galván, CINVESTAV-IPN, Mexico
F. de Moure Flores, CINVESTAV-IPN, Mexico
A. Hernández Hernández, CINVESTAV-IPN, Mexico
S. Cerón Gutiérrez, CINVESTAV-IPN, Mexico
K. Nieto Zepeda, CINVESTAV-IPN, Mexico
M.A. Meléndez Lira, CINVESTAV-IPN, Mexico
Correspondent: Click to Email

Laser ablation technique allows depositing thin films with the same stoichiometry of the target material. The common use of solid targets is a limitation when there is a need to produce ternary alloys. In order to overcome that limitation we designed a modification of the laser ablation technique to employ powders as target.1

The incorporation of carbon in a SiGe alloy is an alternative for achieving larger band gap and strain compensation. The main problem to control substitutional carbon concentration in SiGeC is the low solubility coefficient of carbon in silicon. Laser ablation technique allows exploring deposition parameters far from the equilibrium that could improve the content of substitutional carbon.

In this work we present the growth and characterization of thin films of Si1-x-yGexCy alloys in the compositions range 0.27 ≤ x ≤ 0.29 and 0.01 ≤ y ≤ 0.03 deposited at different temperatures using the Modified Laser Ablation technique.

The samples where characterized by scanning electron microscopy, atomic force microscopy, X ray diffraction, energy dispersive X-ray spectroscopy, Raman, photoluminescence and photoreflectance spectroscopies. Results indicate the modification of the electronic properties of the alloys depending on the carbon content.

1 M. González-Alcudia, A. Márquez-Herrera, M. Zapata-Torres, M. Meléndez-Lira and O. Calzadilla-Amaya, Adv. in Tech. of Mat. And Mat. Proc. J. 9, 81 (2007).