Paper TF2-MoM9
Electrically Conductive Fiber Media by Atomic Layer Deposition of Tungsten
Monday, November 9, 2009, 11:00 am, Room B4
Session: |
Metals and Nitrides (ALD/CVD) |
Presenter: |
J.S. Jur, North Carolina State University |
Authors: |
J.S. Jur, North Carolina State University J.-S. Na, North Carolina State University G.N. Parsons, North Carolina State University |
Correspondent: |
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The ability to create electrically conductive fiber mats and bundles, woven fabrics, and engineered polymer structures offers unique possibilities for emerging technologies such as sensors, optical and radio wave shielding, flexible heating elements, liquid and gas permeation, as well as new platforms for renewable energy devices. Conductive fiber systems have been largely been confined to the use of metal particle fillers and use of the conductive polymers that limit the properties of the fiber media. Here we report the use of atomic layer deposition (ALD) of tungsten using WF6 and Si2H6 as a precursor and reactant, respectively, as a novel and systematic method to conformally coat an electrically conductive material on complex fiber architectures. By ALD processing, a uniform coating of tungsten was achieved at a temperature of 180 °C on quartz tissues with fibers ranging in diameter from 250 nm to 3 μm. A deposition rate of 3.4 Å/cycle was measured by deposition of tungsten on Si coated with ~80 Å of ALD Al2O3. The tungsten growth nucleation period on the quartz tissue is predicted to be similar to tungsten growth on Al2O3. Scanning electron microscopy showed only minor cracking of the tungsten film coating on the quartz fibers, even after handling. The resistivity of ALD tungsten thin films grown on Al2O3 was < 200 μOhm cm, and measurements show similar resistivity values for the tungsten deposited on the quartz fiber. Electronic transport differences in measurement of resistivity and the subsequent mechanisms for conductive pathways through fiber bundles compared to monolithic structures will be discussed. These results suggest new opportunities in the use of ALD processing to create electronically active fiber systems.