AVS 56th International Symposium & Exhibition | |
Thin Film | Monday Sessions |
Session TF2-MoM |
Session: | Metals and Nitrides (ALD/CVD) |
Presenter: | K.J. Hughes, Cornell University |
Authors: | K.J. Hughes, Cornell University J.R. Engstrom, Cornell University |
Correspondent: | Click to Email |
One of the least understood aspects of atomic layer deposition (ALD) is the initial stage of growth, which involves the first set of reactions between the thin film precursors and the substrate. As ALD growth is invariably conducted on foreign substrates, the surface must evolve from that representing the starting substrate, to that eventually representing the steady-state growth surface. Here we employ in situ x-ray photoelectron spectroscopy (XPS) to examine the initial stages of growth of TaNx from the reactions of Ta[N(CH3)2]5 and NH3 on SiO2, porous low-κ substrates, and both of these substrates modified with interfacial organic layers (IOLs). In this presentation, first, we will examine the effect of the density of the reactive adsorption sites (-OH groups) on SiO2 and SiO2 based porous low-κ substrates. Here we find that the saturation density (coverage) of Ta depends strongly on the initial density of –OH. Moreover, we find that there is a strong correlation between the amount of ligand loss in this first half-cycle, and the density of the reactive adsorption sites. For example, on porous low-κ substrates, reactions involving the loss of a single ligand and formation of –O-Ta[N(CH3)2]4(a) species dominate. In contrast, on surfaces with a high density of –OH (SiO2), ligand loss is much more significant. Second, another important feature that XPS can probe is the chemical state of the primary thin film constituents. One process observed in the first cycles of growth is the shift in the position of the N(1s) peak, from a binding energy of ca. 398.9 eV to 397.2 eV. The former binding energy corresponds well to that reported for –N(R)2 species (398.6), while the latter is close to that reported for TaN (397.5) and Ta3N5 (396.9). As a final example, we will consider growth of TaNx on SiO2 and porous low-κ substrates modified with interfacial organic layers. We have found that adsorption of a branched polymer possessing a high density of –NH2 species on the porous dielectric increases both the initial uptake of Ta[N(CH3)2]5 in the first half cycle, and the growth rate per cycle. Here an important issue concerns the fate of the IOL—does the ALD thin film quickly and uniformly cover the IOL, or are there reactions between the ALD precursors and the IOL? We find that the fate of the IOL depends strongly on the density and spatial distribution of reactive groups in the organic layer. We will discuss the implications of these observations concerning the use of IOLs as nucleation promoters in ALD.