| AVS 56th International Symposium & Exhibition | |
| Advanced Surface Engineering | Tuesday Sessions |
| Session SE-TuM |
| Session: | Hard and Nanocomposite Coatings |
| Presenter: | J.H. Hsieh, Ming Chi University of Technology, Taiwan |
| Authors: | J.H. Hsieh, Ming Chi University of Technology, Taiwan P.C. Liu, Ming Chi University of Technology, Taiwan C. Li, Nanyang Technological University, Singapore |
| Correspondent: | Click to Email |
TaN–Cu nanocomposite films were deposited by reactive co-sputtering on Si and tool steel substrates. The films were then annealed using RTA (Rapid Thermal Annealing) at 400 °C for 2, 4, 8 minutes respectively to induce the nucleation and growth of Cu particles in TaN matrix and on film surface. Cu nano-particles emerged on the surface of TaN-Cu thin films were then removed after the samples were tested for their anti-wear and anti-bacterial behaviors. The samples were then re-annealed (rejuvenated), and re-tested for their anti-wear and anti-bacterial behaviors. The results reveal that the rejuvenated samples could have similar anti-wear and anti-bacterial behaviors so long as the annealing conditions were well adjusted. However, the hardness of the samples would decrease to a certain extent.