AVS 56th International Symposium & Exhibition
    MEMS and NEMS Thursday Sessions
       Session MN+GR-ThM

Paper MN+GR-ThM3
Enhanced Stabilities in Resonant Response of Carbon Nanotube Network Reinforced Al Thin-Film Nanomechanical Resonators

Thursday, November 12, 2009, 8:40 am, Room A8

Session: Graphene and Carbon Based MEMS/NEMS Devices
Presenter: Y.D. Kim, Seoul National University, South Korea
Authors: Y.D. Kim, Seoul National University, South Korea
J.H. Bak, Seoul National University, South Korea
J. Lee, Seoul National University, South Korea
S.R. Lee, Seoul National University, South Korea
K. Char, Seoul National University, South Korea
S. Hong, Seoul National University, South Korea
Y.D. Park, Seoul National University, South Korea
Correspondent: Click to Email
With superior mechanical properties, single-walled carbon nanotubes (swCNT) are an attractive reinforcement component for nanoscale composites, based in either polymer or metal matrices [1]. Recently enhancements in mechanical properties of metallic thin-films reinforced by CNTs have been reported [2]. Self-consistent results from quasi-static and dynamic flexural measurements indicate the elastic modulus to nearly double with the inclusion of self-assembled swCNT network layer in Al thin-films [3]. Here, we present significant enhancements in resonant frequency stability of CNT network reinforced Al thin-film nanomechanical resonators. We characterize the stability in the resonant response either by long-cycle measurements or with applied stress. Long-cycle (>1011) dynamic flexural measurements show suppression of anelastic effects, which limits the applicability of metallic thin-films nanomechanical resonators. Application of stress is accomplished by two differing methods. A tensile stress is applied by using a ‘chip-bending’ method. A compressive stress is applied through thermal-elastic effects from Joule heating. For both cases, a significant stability in CNT network reinforced Al thin-film resonant response is observed.

[1] W.A. Curtin and B.W. Sheldon, Materials Today 7, 44 (2004); J.N. Coleman et al., Advanced Materials 18, 689 (2006).

[2] Kang et al., Advanced Materials 19, 427 (2007).

[3] J.H. Bak, Y.D. Kim, et al., Nature Materials 7, 459 (2008).