Thin films of organic materials differ fundamentally in many respects when compared to inorganic materials (metals, semiconductors and oxides). A key difference involves the presence of strong covalent/ionic bonding in the latter, whereas organic materials are often bound by rather weak dispersion forces. Another importance difference involves the methods and conditions used to assemble, fabricate and/or pattern these materials. For example, inorganic materials are often deposited at high temperatures, and patterned using aggressive subtractive techniques. Organics, on the other hand, can be deposited at very mild conditions, and can be patterned using additive techniques such self assembly. Interestingly, in many emerging technologies, fabricating robust interfaces between these two diverse classes of materials is absolutely essential, yet extremely challenging. In this talk we will present a summary of recent findings concerning the formation of two important interfaces: organic-on-inorganic and inorganic-on-organic. Concerning the former, we are currently conducting studies of the deposition of pentacene on clean and modified SiO@sub 2@ surfaces using supersonic molecular beam techniques. In this work we have focused initially on the effects of incident kinetic energy, angle of incidence and substrate temperature on both submonolayer and multilayer growth. Some of our more interesting observations include an effect of incident kinetic energy on the ratio of deposition rates observed for submonolayer vs. multilayer growth, and the presence of so-called rapid roughening for multilayer thin films. Concerning the latter type of interface, we are currently investigating the use of self-assembled monolayers (SAMs) to promote nucleation and growth of ultrathin inorganic films (TiN) via atomic layer deposition. In this work we have focused particularly on the initial nucleation regime, where we find that the SAMs affect nucleation significantly and in unexpected ways.