AVS 53rd International Symposium
    Surface Science Tuesday Sessions
       Session SS-TuP

Paper SS-TuP41
Metallization of Self-Assembling Monolayers of Conjugated Molecules by Electroless Deposition of Cu

Tuesday, November 14, 2006, 6:00 pm, Room 3rd Floor Lobby

Session: Surface Science Poster Session
Presenter: C.T. Nottbohm, University of Bielefeld, Germany
Authors: C.T. Nottbohm, University of Bielefeld, Germany
A. Turchanin, University of Bielefeld, Germany
A. Gölzhäuser, University of Bielefeld, Germany
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Metallization of self-assembling monolayers (SAMs) is of great interest for various areas of fundamental and applied research: fabrication of microelectronic and molecular electronic devices, establishing of electrical contacts to single molecules, metal pattering of supramolecular assemblies. Here we present an investigation of the Pd catalysed electroless deposition (ELD) of Cu on top of the amino-terminated cross-linked biphenylthiol SAMs. The lateral cross-linking and formation of amino groups have been achieved by irradiation of nitrobiphenylthiol SAMs with low energy electrons.@footnote 1@ The x-ray photoelectron spectroscopy (XPS) and atomic force microscopy (AFM) data show that the cross-linked SAM acts as a barrier suppressing the catalyst-free ELD of Cu on the Au substrate. In order to deposit Cu on the cross-linked SAMs a Pd(0) catalyst was immobilized to their surface. This was realized by the chemical reduction of Pd(II) ions coordinated to the terminal amino groups. Angle resolved X-ray spectroscopy (ARXPS) verified every step of the Pd immobilization und unambiguously show that it forms an outermost layer of the cross-linked SAM. The AFM/XPS data show that Cu is then deposited in cross-linked areas at the catalytic site and hence on the surface of the SAM. @FootnoteText@ @footnote 1@ A. Gölzhäuser, W. Eck, W. Geyer, V. Stadler, Th. Weimann, P. Hinze, M. Grunze, Adv. Mater. 13, 806 (2001).