AVS 53rd International Symposium
    Advanced Surface Engineering Thursday Sessions
       Session SE1-ThM

Paper SE1-ThM5
Surface Wettability of Stainless Steel Treated using C@sub 2@H@sub 2@ Plasma using Plasma-based Ion Implantation

Thursday, November 16, 2006, 9:20 am, Room 2007

Session: Pulsed Plasmas in Surface Engineering
Presenter: T. Tanaka, Hiroshima Institute of Technology, Japan
Authors: T. Tanaka, Hiroshima Institute of Technology, Japan
R. Wang, Hiroshima Institute of Technology, Japan
T. Takagi, Hiroshima Institute of Technology, Japan
Correspondent: Click to Email
Plasma-based ion implantation (PBII) with negative voltage pulses to the test specimen has been applied to the surface treatment process as a technique suitable for three-dimensional work pieces. Also, the surface property of stainless steel for semiconductor process using corrosive gases is important. The surface of stainless steel was treated in C@sub 2@H@sub 2@ gas using Plasma base ion implantation (5 µsec pulse width, 300 pulses/s, -10 kV). The contact angle of a water-droplet on each specimen surface was measured by using a digital microscope and the contact angle was obtained. The contact angle of specimens without C@sub 2@H@sub 2@ plasma treatment was about 90 degree, while that of specimens with C@sub 2@H@sub 2@ plasma treatment was about 64 degree. It found that the surface wettability of stainless steel largely enhanced by the C@sub 2@H@sub 2@ plasma treatment using plasma-based ion implantation.