AVS 52nd International Symposium
    Electronic Materials and Processing Tuesday Sessions

Session EM2-TuM
High-k Dielectric Characterization

Tuesday, November 1, 2005, 8:20 am, Room 312
Moderator: G. Wilk, ASM America


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  in Adobe Acrobat format  

Click a paper to see the details. Presenters are shown in bold type.

8:20am EM2-TuM1 Invited Paper
Characterization of High-@kappa@ Materials using High Resolution Ion Backscattering
T. Gustafsson, E. Garfunkel, L.V. Goncharova, R. Barnes, D. Starodub, Rutgers University
9:00am EM2-TuM3
Fermi Level Pinning at Re/HfO@sub2@ Interface and Effective Work Function of Re in Re/HfO@sub2@/SiO@subx@/n-Si Stack
Y. Liang, J. Curless, C. Tracy, D. Gilmer, J. Schaeffer, D. Triyoso, P. Tobin, Freescale Semiconductor Inc.
9:20am EM2-TuM4
Oxygen Diffusion and Reduction of Interfacial Layer in high-k Metal Oxide Gate Stacks
L.V. Goncharova, Rutgers University, M. Dalponte, Universidade Federal do Rio Grande do Sul, Brazil, T. Gustafsson, E. Garfunkel, Rutgers University
9:40am EM2-TuM5 Invited Paper
Characterization of High- and Low-k Dielectrics Materials using Secondary Ion Mass Spectrometry
J. Bennett, ATDF
10:20am EM2-TuM7
Combined Electrical and Morphological Characterization of Al@sub 2@O@sub 3@ Films by Non-Contact AFM
J.M. Sturm, A.I. Zinine, H. Wormeester, R.G. Bankras, J. Holleman, J. Schmitz, B. Poelsema, University of Twente, The Netherlands
10:40am EM2-TuM8
The Effect of Surface Pre-treatment upon the Growth of Hafnium Dioxide Layers on Silicon
P. Mack, R.G. White, J. Wolstenholme, Thermo Electron, UK, T. Conard, IMEC, Belgium
11:00am EM2-TuM9
Atomic Layer Deposition and Characterization of Hafnium and Aluminum Oxides and Hafnium Aluminates on Silicon
R.R. Katamreddy, A. Deshpande, University of Illinois at Chicago, R. Inman, A. Soulet, G. Jursich, American Air Liquide, C.G. Takoudis, University of Illinois at Chicago
11:20am EM2-TuM10
Measurement of Thicknesses of HfO@sub 2@, HfSiO@sub 4@, ZrO@sub 2@, and ZrSiO@sub 4@ Films on Silicon by Angle-Resolved XPS
W. Smekal, W.S.M. Werner, Vienna University of Technology, Austria, C.J. Powell, National Institute of Standards and Technology