High density of interfaces can strongly impede heat conduction across nanolaminates. This can be exploited to create superior thermal barrier coatings without compromising mechanical or chemical protection characteristics. Thermal barrier coatings are critical elements that help reduce power requirements of solid-state phase change memory devices and thermally assisted magnetic recording media. Previous theoretical and experimental studies have improved our understanding of the thermal interface resistance. Significant discrepancy, however, still exists between theoretical predictions and experimental data at elevated temperatures. We will present experimental and theoretical studies of energy transport across interfaces between nanoscale metal and dielectric thin films. We will describe details of sample preparation and data analysis procedures we developed to address challenges involved in accurate measurements. The thermal interface resistance between Ta and amorphous AlOx is found to be considerably smaller than previously reported values for comparable metal-dielectric interfaces, which suggest that the intrinsic interface resistance is closer to the model prediction than previously suggested. We also report the thermal resistance of nanolaminates consisting of alternating layers of metal and dielectric materials. The thermal conductivity of the nanolaminates is found to be well-below the minimum thermal conductivity limit of each component and is consistent with our single interface thermal resistance data. We will also describe a continuum two-fluid model we develop to examine the impact of spatial non-equilibrium between electron and phonon on the thermal resistance of nanolaminates. Fundamental understanding of nanoscale energy transport across interfaces will allow systematic design and engineering of interfaces to either enhance or suppress heat conduction in nanolaminates.