In this study using low pressure plasma polymerized thin intermediate layer bonding process the silicon-to-silicon and glass-to-glass substrate bonding in micro/nano devices was successfully carried out. This process has advantage for bonding of glass and silicon types of substrate materials al low bonding temperature up to 130oC. The bond strength was more than 2 MPa for an about 100 nm intermediate plasma polymerised acrylic acid, p-xylenne, styrene, 1-vinyl-2-pyrrolininne and allylamine intermediate layers on glass and silicon substrates. The intermediate plasma polymerised thin layer bonding strange was also tested for continuously more than 24 hours with changing the room temperature from 25 to 35 oC and bonding does not shows any problem. This bonding process has advantage in the micro/nano devices applications in biology where the control of surface properties is required and also this process allows the device to be reusable. In this study the fabrication of bio-MEMS was carried out using plasma polymerisation process with optical lithography, wet and dry etching techniques on silicon/glass substrate. An asymmetric electrode array used for micro pump in micro fluidic device with small electrode (4 µm wide) separated from the large electrode (20 µm wide) by 20 µm and 6 µm gaps in both sides respectively.