AVS 51st International Symposium | |
Materials Solutions for Cooling Technology Topical Conference | Monday Sessions |
Click a paper to see the details. Presenters are shown in bold type.
8:20am | CT+TF-MoM1 Impact of Electron-Phonon Coupling on Thermal Boundary Resistance by Molecular-Dynamics Simulation R.J. Stevens, P.M. Norris, University of Virginia |
8:40am | CT+TF-MoM2 Thin Film SiGe Superlattice Micro Refrigerators Flip-Chip Bonded with IC Chips Y. Zhang, A. Shakouri, University of California, Santa Cruz, G. Zeng, University of California, Santa Barbara, P. Wang, A. Bar-cohen, University of Maryland |
9:00am | CT+TF-MoM3 Interfaces, Functionalization and Heat Flow in Nanoscale Materials. S. Shenogin, A. Bodapati, L. Xue, P. Keblinski, Rensselaer Polytechnic Institute |
9:20am | CT+TF-MoM4 Invited Paper Thermal Transport in Nanostructured Materials D. Cahill, University of Illinois, Urbana-Champaign |
10:00am | CT+TF-MoM6 Invited Paper Thin Film Micro Refrigerators for on Chip Thermal Management A. Shakouri, University of California at Santa Cruz |
10:40am | CT+TF-MoM8 Invited Paper Micro- and Nanoscale Thermal Phenomena in Magnetic Recording Heads Y.S. Ju, UCLA |
11:20am | CT+TF-MoM10 Invited Paper Transport and Mechanics in Hard and Soft Nanomaterials A. Majumdar, University of California, Berkeley |