AVS 51st International Symposium
    Applied Surface Science Tuesday Sessions

Session AS-TuM
Electron Spectroscopies

Tuesday, November 16, 2004, 8:20 am, Room 210A
Moderator: R. Haasch, University of Illinois, Urbana


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  in Adobe Acrobat format  

Click a paper to see the details. Presenters are shown in bold type.

8:20am AS-TuM1
Light Induced Chemically Resolved Electrical Measurements (LICREM) in XPS: Anomalous Photoresponse of CdSe Nanoparticle Films
H. Cohen, S. Sarkar, G. Hodes, The Weizmann Institute of Science, Israel
8:40am AS-TuM2
Validation of Information Gained from the XPS Survey Scan
J.E. Castle, C. Lavie-Compin, University of Surrey, UK
9:00am AS-TuM3 Invited Paper
Extensions of Photoelectron Spectroscopy to the Study of Nanoscale Systems
R.L. Opila, K. Demirkan, A. Mathew, University of Delaware
9:40am AS-TuM5
XPS Chemical Depth Profiling Using C@sub 60@ Ion Beams
N. Sanada, A. Yamamoto, H. Iwai, ULVAC-PHI, Inc., Japan, J.F. Moulder, Physical Electronics, R. Oiwa, Y. Ohashi, ULVAC-PHI, Inc., Japan
10:00am AS-TuM6
X-Ray Photoelectron Spectroscopy of Rubber Compounds: Temperature Dependence and Crosslink Distribution
G.E. Hammer, The Goodyear Tire & Rubber Company
10:20am AS-TuM7
Monte Carlo Simulations of Electron Backscattering from Surfaces in Scanning Auger Microscopy
C. Powell, NIST, A. Jablonski, Institute of Physical Chemistry, Poland
10:40am AS-TuM8
Round Robin Study of Evaluation of Electron Beam Damage of SiO2/Si in Auger Microprobe Analysis
S. Tanuma, T. Kimura, National Institute for Materials Science (NIMS), Japan, S. Hashimoto, Kokankeisoku, Japan, M. Inoue, Setsunan University, Japan, M. Suzuki, ULVAC-PHI, Inc., Japan
11:00am AS-TuM9
Performance of a High throughput TOF-HREELS Analyzer
Z. Yang, University of Maine, R.H. Jackson, Stillwater Scientific Instruments, P.H. Kleban, B.G. Frederick, University of Maine
11:20am AS-TuM10
Oxygen Environmental Electron Spectroscopy and Microscopy: A New Concept for Reducing Harmful Electron Beam Effects on Insulating Samples
Y. Ji, H. Guo, Beijing University of Technology, China, V. Kempter, Technische Unviversität Clausthal, Germany