AVS 50th International Symposium
    Thin Films Friday Sessions
       Session TF-FrM

Paper TF-FrM5
Intrinsic Stresses in CrN Films Deposited by Arc Ion Plating

Friday, November 7, 2003, 9:40 am, Room 329

Session: Mechanical Properties of Thin Films
Presenter: K. Kusaka, Tokushima University, Japan
Authors: T. Hanabusa, Tokushima University, Japan
K. Kusaka, Tokushima University, Japan
T. Matsue, Niihama National College of Technology, Japan
Correspondent: Click to Email
It is well known that large compressive residual stresses of the order of GPa develop in TiN and CrN films deposited by ion plating. The residual stress in the film is the sum of thermal stress and intrinsic stress. The former is the stress originated by the difference in the thermal contraction between the substrate material and the film, whereas the latter is originated by various factors during the depositing process. The residual stress in TiN or CrN film is predominantly the intrinsic stress. The object of this study is to investigate an essential meaning of the intrinsic stress in the films. In this experiment CrN film was deposited on a stainless steel substrate. Residual stress in the CrN film was measured by X-ray diffraction. The X-ray residual stress measurement revealed that macroscopic compressive stress and microscopic stress in the film are reduced by annealing the film/substrate system. The relation between the lattice strain and the applied stress is investigated for the specimen annealed at various temperature stage.