| 2:00pm |
MS-MoA1 Invited Paper
Process Optimizations of Electrochemically Deposited Copper Films
H. Simka, S. Shankar, R.P. Chalupa, V.M. Dubin, Intel Corporation |
| 2:40pm |
MS-MoA3
Real-Time Control of Ion Density and Ion Energy in Chlorine Inductively Coupled Plasma Etch Processing
C.H. Chang, K.C. Leou, C. Lin, T.L. Lin, C.W. Tseng, C.H. Tsai, National Tsing Hua University, Taiwan, ROC |
| 3:00pm |
MS-MoA4
Mathematical Approaches to Optimal Control of Transient Enhanced Diffusion
M.Y.L. Jung, R. Gunawan, R.D. Braatz, E.G. Seebauer, University of Illinois |
| 3:20pm |
MS-MoA5
Spatially Programmable Reactor Design: Toward a New Paradigm for Equipment Effectiveness
Y. Liu, J. Choo, L. Henn-Lecordier, G.W. Rubloff, R.A. Adomaitis, University of Maryland |
| 3:40pm |
MS-MoA6
Monitoring and Control of Binary Gas Mixtures from Solid Phase MOCVD Sources using an Acoustic Sensor
L. Henn-Lecordier, J.N. Kidder, G.W. Rubloff, University of Maryland |
| 4:00pm |
MS-MoA7
Dynamic Simulation and Optimization at the Unit Process Level for Environmentally Benign Semiconductor Manufacturing
S. Cho, W. Lei, G.W. Rubloff, University of Maryland |
| 4:20pm |
MS-MoA8
Data Handling in Semiconductor Manufacturing: Overall Approach to Correlate Yield, Process and Equipment Parameters
M. Horn, H. Melzner, D. Knobloch, F.H. Bell, Infineon Technologies AG, Germany |
| 4:40pm |
MS-MoA9
Improved Tool Utilization and Process Capability Through Improved Flow Verficiation Technique
S.A. Tison, S. Lu, Mykrolis Corporation |