IUVSTA 15th International Vacuum Congress (IVC-15), AVS 48th International Symposium (AVS-48), 11th International Conference on Solid Surfaces (ICSS-11)
Manufacturing Science and Technology
Monday Sessions
Session MS-MoA
Invited Paper MS-MoA3
Integrated Circuit Challenges for sub-100nm Generations
Monday, October 29, 2001, 2:40 pm, Room 131
Session:
Manufacturing Technologies for the Information Industry
Presenter:
M. Bohr,
Intel Corp.
Correspondent:
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This talk will cover the challenges faced as transistors and interconnects are scaled to sub-100nm dimensions and review some of the device and material options being investigated to meet these challenges.