Sputtered multilayers of chromium and copper are employed as adhesion enhancing layers on surfaces of graphite-epoxy substrates. These sputtered layers provide a basis for electroplating copper and silver. The effects of substrate preparation techniques upon adhesion strength of deposited metal films are investigated. The stud pull adhesion test is employed as a tool for quantitative measurement of adhesion strengths of metal films on graphite-epoxy substrates. Preparation techniques studied include wet or dry abrasion, using "Scotch Brite" or 400 grit sandpaper, and non-abrasive cleaning, using surfactants, water, and solvents. For as-sputtered material, highest stud pull strengths are associated with wet abrasion and pre-sputter cleaning with aqueous surfactants, DI water, and solvents. Lowest adhesion strengths are associated with non-abrasive cleaning, using the same agents. Effects of thermal cycling in air upon adhesion vary with surface preparation before sputtering. Dry abrasion and solvent cleaning lead to the highest adhesion strengths after thermal cycling, while non-abrasive cleaning is again associated with the lowest strengths. Adhesion of electroplated silver and copper to sputter coated graphite-epoxy also varies with surface preparation before sputtering. In contrast to as-sputtered results, abraded surfaces are associated with reduced plating adhesion, and unabraded surfaces with enhanced plating adhesion. Surface analysis (AES and ESCA) results suggest that formation of a thin carbide phase at the interface between the graphite-epoxy and sputtered chromium correlates with higher adhesion strength, while unusually high oxygen content at the interface correlates with lower adhesion strength.