While the rapid miniaturization of electronics has driven much of the development of computation and information systems, it is anticipated that future computational demands for performing calculations orders of magnitude faster with less power. To create discovery beyond silicon, the DARPA Moletronics program is proposing that both computational functionality and input/output architecture can be designed in molecular systems. These systems will high device density (scaleable to 10@super 12@ device/cm@super 2@) and be amenable to greatly simplified manufacturing fabrication using hierarchical-assembly. It is anticipated that architecture, a top-down approach will play an immense role in steering discovery. Moletronics is focussed on developing technologies based on the self-assembly of molecular components to act as devices, switches, and interconnects. The program does not clone contemporary electronic devices with molecular scale components, but rather create functionality that exploits what molecules are good at (self-assembly, thermodynamic equilibrium, and charge storage media.) The trick for molecular computers will be to cope with defects and to realize hierarchical processes to manufacture the hardware. Hierarchical assembly is envisaged as a set of processes that will first assemble individual devices, then create functional blocks (circuits) from those devices and finally assemble systems from the blocks. It is a bottom-up manufacturing process whereas current microelectronics fabrication is based on top-down manufacturing using lithography. The talk will discuss three over-riding themes of the Moletronics program: (1) molecular devices, (2) hierarchical assembly, and (3) architecture including defect tolerance and algorithm development to find the defects.
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@footnote 1@ The contributions of the contractors of the DARPA Moletronics program and fellow program managers, Bruce Gnade, Christie Marrian, and John Pazik are gratefully acknowledged.