| AVS 45th International Symposium | |
| The Science of Micro-Electro-Mechanical Systems Topical Conference | Monday Sessions |
Click a paper to see the details. Presenters are shown in bold type.
| 2:00pm | MM+VT-MoA1 Invited Paper Polysilicon Sealed Vacuum Cavities for MEMS J.D. Zook, W.R. Herb, Honeywell, Y.C. Ahn, H. Guckel, University of Wisconsin |
| 2:40pm | MM+VT-MoA3 Wafer Level Vacuum Packaging for MEMS R.W. Gooch, T.R. Schimert, W.R. McCardel, B.A. Ritchey, Raytheon Systems Co. |
| 3:00pm | MM+VT-MoA4 A Dual Sensor Vacuum Gauge: Advanced Micromachined Thin Film Pirani Sensor Combined with a Piezoresistive Sensor D.H. Baker, R.A. Outlaw, Teledyne Hastings Instruments, D. Rosenblatt, Rosenblatt Associates |
| 4:00pm | MM+VT-MoA7 The Knudsen Compressor as a Micro and Macroscale Vacuum Pump Without Moving Parts or Fluids S.E. Vargo, E.P. Muntz, G.R. Shiflett, University of Southern California, W.C. Tang, Jet Propulsion Laboratory |
| 4:20pm | MM+VT-MoA8 Novel Microvalve with Low Leakage M. Hirano, K. Yanagisawa, Nippon Telegraph and Telephone Corporation, Japan, S. Nakano, NTT Advanced Technologies Corporation, Japan, M. Shoji, Nippon Telegraph and Telephone Corporation, Japan |